Name: Breadboard 830 Tie-points
Brand: Ampereco Robotics
SKU: AMP-2283
Price: 24.00 QAR
Availability: InStock

The Breadboard 830 Tie-points is a full-size solderless breadboard designed for easy and flexible circuit prototyping. It features 830 tie points with a standard 2.54 mm pitch, making it compatible with DIP ICs, sensors, and popular development boards like Arduino and Raspberry Pi. Its solderless design allows you to build and test circuits quickly without the need for soldering.

Specifications

Model	Breadboard 830 Tie-points
Total Tie Points	830
Terminal Strips	630 tie points
Power Rails	200 tie points
Terminal Columns	10 columns
Terminal Rows	63 rows
Pin Pitch	2.54 mm
Center Gap	7.62 mm
Supported Wire Size	20–29 AWG
Power Rail Type	Split dual rails
Mounting Type	Self-adhesive backing
Board Type	Solderless breadboard
Material	ABS plastic housing
Contact Material	Nickel-plated spring clips
Board Dimensions	165 × 55 × 9 mm
Compatibility	DIP ICs, Arduino, Raspberry Pi, sensors and modules

Applications: Rapid circuit prototyping, Electronics testing and development, Educational labs and training, Embedded systems projects, Arduino and Raspberry Pi experimentation, Sensor and module integration, DIY electronics projects, Circuit design and debugging.

Key Features

Large Tie Points – Offers 830 tie points for building complex circuits.
Standard Pitch – 2.54 mm pin spacing compatible with common components.
Dual Power Rails – Split power rails provide flexible power distribution.
Interlocking Design – Side tabs allow multiple breadboards to be connected together.
Self-Adhesive Backing – Secure mounting during use for stability.
Solderless Construction – Reusable design enables quick assembly and modification.