Mini Breadboard – 170 Points, White

The Mini Solderless Breadboard is a compact prototyping platform designed for small electronic circuits and quick testing applications. It features 170 tie points with a standard 2.54 mm pitch, making it suitable for DIP IC breakout, sensor connections, and breadboard-based development projects. The snap-fit design allows multiple boards to connect together for expanded prototyping space, while the self-adhesive backing and M2 mounting holes provide secure installation options. Ideal for embedded systems, educational electronics, and rapid hardware prototyping.

Features

- 170 tie-point solderless prototyping area

- Standard 2.54 mm pitch spacing

- Compact design for small circuits

- Snap-fit edges for board expansion

- Peel-and-stick adhesive backing

- Dual M2 mounting holes

- Compatible with DIP package ICs

- Supports reusable circuit prototyping

- White ABS plastic housing

- Nickel-plated spring contacts

- Suitable for jumper wire connections

- Lightweight portable construction

- No soldering required

- Reliable contact retention design

- Ideal for educational electronics projects

Specifications

- Tie Points: 170

- Terminal Strip Points: 17 × 10 rows

- Pitch Spacing: 2.54 mm

- Board Type: Solderless Mini Breadboard

- Contact Material: Nickel-Plated Spring Metal

- Housing Material: ABS Plastic

- Color: White

- Mounting Method: Adhesive Backing and M2 Holes

- Compatible Wire Size: 20–29 AWG

- Board Dimensions: 47 × 35 × 10 mm

- Mounting Hole Diameter: M2 Compatible

- Reusable: Yes

- Operating Temperature: -20°C to 80°C

- Application Type: Rapid Circuit Prototyping

- IC Compatibility: DIP Packages

Links

- Mini Solderless Breadboard 3D Model

Tutorials

- How To Use a Breadboard - Breadboard Basics